| PART |
Description |
Maker |
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS
|
| PC829 PC849 |
High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| BL817 |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| LTV847 LTV817 |
HIgh Density Mounting Type Photocoupler
|
Lite-On Technology Corporation
|
| PC849 |
High Density Mounting Type Photocoupler
|
Sharp Electrionic Compo...
|
| UDZSTE-1720B |
Compact, 2-pin mini-mold type for high-density mounting. (UMD2)
|
Rohm
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSM88WA |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| EC2-6 EC2 EC2-12ND EC2-12NP EC2-12NU EC2-12NJ EC2- |
High Insulation, High breakdown voltage, compact and lightweight, Surface mounting type
COMPACT AND LIGHTWEIGHT/ SMALL MOUNTING SIZE/ HIGH BREAKDOWN VOLTAGE
High Insulation/ High breakdown voltage/ compact and lightweight/ Surface mounting type
A/D Converter (A-D) IC; Resolution (Bits):24; Sample Rate:192kSPS; Input Channels Per ADC:8; Input Channel Type:Differential; Data Interface:Serial; Package/Case:48-LQFP RoHS Compliant: Yes
CONNECTOR ACCESSORY
Film Capacitor; Capacitor Type:Suppression; Voltage Rating:100VDC; Capacitor Dielectric Material:Polyester; Capacitance:0.022uF; Capacitance Tolerance: 10%; Lead Pitch:5.00mm; Leaded Process Compatible:Yes RoHS Compliant: Yes
COMPACT AND LIGHTWEIGHT, SMALL MOUNTING SIZE, HIGH BREAKDOWN VOLTAGE 小巧轻盈，小安装尺寸，高击穿电压
|
NEC Corp.
NEC, Corp.
|
| LTV-354T |
Hybrid substrates that require high density mounting
|
光宝科技股份有限公司
|
| 5694F-A 5694F7 5694F1 5694F3 5694F5 |
High Density Right Angle Mounting T-1 LED Assembly
|
CML[Chicago Miniature Lamp,inc]
|
| ISP321-1-88XSM |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM
List of Unclassifed Manufacturers
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